What is a semiconductor package? What are the three main semiconductor packages?

Semiconductor packaging refers to the process of processing the tested wafers into individual chips according to the product model and functional requirements. Packaging process is: from the wafer before the process of wafer scribing process is cut into small wafers (Die), and then cut the wafer with glue mounted to the corresponding substrate (lead frame) frame of the island, and then the use of ultra-fine metal (gold, tin, copper and aluminum) wire or conductive resin will be the wafer's bonding pads (Bond Pad) to connect to the substrate's corresponding pins (Lead),semiconductor testing and constitute the required circuit; and then the independent chip with a plastic shell to get The required circuit; and then the independent chip with a plastic shell to be encapsulated to protect the plastic sealing, but also a series of operations after the completion of the package for the finished product testing, usually after the inspection (Incoming), testing (Test) and packaging (Packing) and other processes, and finally warehoused for shipment.

Semiconductor three packages are based on the materials used to divide the semiconductor device package form metal package, ceramic package, metal a ceramic package and plastic package.

The first category: semiconductor metal package

Metal package began with the transistor package, and then slowly applied to the inline flat package, basically metal - glass assembly process. Due to the strict size of the package, high precision, metal parts to facilitate mass production, so its low price,semiconductor failure analysis excellent performance, packaging process is easy and flexible, is widely used in transistors and hybrid integrated circuits such as oscillators, amplifiers, frequency discriminators, AC/DC converters, filters, relays, etc., and now and in the future, many of the miniature packages and multichip modules (MCM) are also used in this metal package. Types of metal packages include optoelectronic device packages with optical window type, with lens type and with fiber type; discrete device packages including A-type, B-type and C-type; hybrid circuit packages including double in-line and flat type; special device packages including moment positive type, multi-layer multi-window type and non-magnetic material type.

The second category: semiconductor ceramic package

Early semiconductor packages are mostly based on ceramic packages, along with the high degree of integration of semiconductor devices and high-speed development, miniaturization of electronic equipment and price reductions, ceramic packages are partially replaced by plastic packages, but many of the uses of ceramic packages are still irreplaceable function, especially the integrated circuit components to improve the operating frequency, signal transmission speed and chip power consumption increases, the need to choose a low Resistivity of the wiring conductor materials,aotomatic prober low dielectric constant, high conductivity insulating materials, etc.. Ceramic package types are DIP and SIP; for large-scale integrated circuit packages including PGA, PLCC, QFP and BGA.

The third category: semiconductor plastic package

Plastic packaging due to its low cost, simple process, and suitable for mass production, and therefore has a strong vitality, since the birth of the development of faster and faster, in the package accounted for an increasing share. Currently, plastic packages account for more than 95% of the integrated circuit market worldwide. In consumer circuits and devices is basically the world of plastic packaging; in industrial circuits accounted for a large proportion of the form of packaging is also the most varied. Types of plastic packages are discrete device packages, including A-type and F-type; integrated circuit packages including SOP, DIP, QFP and BGA.

metal package semiconductor device

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